Coaxial, waveguide, and isoadapters, DC to 110 GHz
LNAs, gain blocks, digital, variable gain, driver, power, and wideband amps. Packaged devices up to 43.5 GHz, bare die up to 100 GHz, and housed assemblies up to 110 GHz
Ultra-miniature ceramic antennas from 13 MHz to 10 GHz
Assembly and Test
RF/Microwave assembly including die attach, wirebonding, and ribbon bonding, SMT and thru hole assembly, testing services and upscreening
Temperature variable (Thermopads®) and Fixed attenuators, coaxial, SMT, and wire-bondable, covering DC to 50 GHz, waveguide attenuators from 4 to 40 GHz
General purpose baluns up to 8 GHz, chipset specific impedance matched balun and balun+filter modules for ADI, Atmel, TI, Nordic, and more.
Cables and Interconnects
Low loss, single cable assemblies and multi-cable interconnects up to 110 GHz.
Ceramic single- and multi-layer, high voltage, high-Q, AC safety, X2Y® EMI filtering, and more, plus a variety of chip capacitors.
End launch, flange mount, and cable connectors in SMA, N, TNC, 2.92mm, 2.4mm, 1.85mm, 1.0mm, and 0.9mm to accommodate designs up to 110 GHz.
Miniature SMT ceramics up to 6 GHz, SMT modules up to 18 GHz, waveguide devices up to 40 GHz, and housed assemblies up to 67 GHz.
Custom Parts and Assemblies
Custom designed parts or assemblies to meet your specific requirements.
Surface mount and bare die up to 44 GHz and coaxial up to 40 GHz.
PIN, Schottky, Varactor, Zener, Step Recovery, and Tunnel diodes, bare die and packaged, for applications up to 80 GHz.
SMT up to 6 GHz for wireless and CaTV applications.
SMT modules up to 12 GHz, waveguide devices up to 36 GHz, and housed assemblies up to 45 GHz.
SMT devices, 50 and 75 ohm, up to 6 GHz in low-pass, high-pass, and band-pass configurations. EMI low pass filters featuring X2Y® technology. Press in, thread in, and solder in low pass DC feed thru’s. Cavity, waveguide, discrete, tunable, and wireless infrastructure filters up to 40 GHz.
SMT devices up to 40 GHz and housed assemblies up to 110 GHz.
Packaged devices up to 45 GHz, bare die up to 50 GHz, and housed assemblies up to 110 GHz.
Housed and SMT gain equalizers with negative slope and parabolic response up to 26.5 GHz.
Broadband conical, high-Q ceramic and wirewound, planar spiral, and AC power inductors.
Isolators and Circulators
Drop-in, SMT, coaxial, and waveguide, isolators and circulators up to 75 GHz.
Packaged devices up to 8 GHz and coaxial up to 18 GHz.
Bare die, SMT, and housed assemblies, up to 46 GHz.
Surface mount devices, including Comb generators, up to 30 GHz and housed assemblies up to 110 GHz.
Digital phase shifters up to 12 GHz.
Power Meters and Sensors
Bench top power meters up to 40 GHz.
Receivers and Transceivers
Complete receiver and transceiver solutions in a single device up to 86 GHz.
Electromechanical relays up to 16 GHz and solid state relays for AC and DC power.
Chip resistors (center, multitap, and single value); SMT, flange-mount, and rod resistors up to 4 GHz; diamond substrate resistors up to 26 GHz; and precision power resistors.
Software for predicting and analyzing performance of a device or system prior to manufacturing or prototyping.
Thin film and PCB substrates.
SMT devices up to 60 GHz, bare die up to 100 GHz, waveguide rotary switches up to 36 GHz, and coaxial switches and matrices up to 40 GHz.
SMT and diamond substrate terminations for up to 26 GHz, waveguide up to 33 GHz, coaxial up to 67 GHz.
Packaged power transistors including GaN on Si for up to 6 GHz.